At the Optical Fiber Communications conference (OFC 2022) in San Diego, CA, USA (8-10 March), Ranovus Inc of Ottawa, Ontario, Canada (which develops and manufactures multi-terabit photonics interconnect solutions for data-center and communications networks) and TE Connectivity (which designs and makes sensors and connectors) have announced that their strategic collaboration has delivered the world’s first Co-Packaged Optics (CPO) platform based on Ranovus’ Odin 800Gbps Analog-Drive CPO 2.0 architecture with TE’s CPx fine-pitch socket interposer technology...
Source: http://www.semiconductor-today.com/news ... 0322.shtml