Engineered materials and optoelectronic component maker II-VI Inc of Saxonburg, PA, USA has closed a contract worth over $100m to supply 150mm silicon carbide (SiC) substrates to China’s Dongguan Tianyu Semiconductor Technology Co Ltd (which specializes in the R&D, design and manufacturing of SiC epitaxial wafers), to be delivered beginning this quarter and through the end of 2023...
Source: https://semiconductor-today.com/news_it ... 0822.shtml