Oxford Instruments Plasma Technology (OIPT) of Yatton, near Bristol, UK recently announced the launch of its silicon carbide (SiC) substrate contactless plasma polishing solution to supersede the established chemical mechanical planarization (CMP) process with a clean, dry, lower-cost, higher-yield and sustainable alternative. The project has now taken a step forward through collaborating with Clas-SiC Wafer Fab Ltd of Lochgelly, Fife, Scotland, UK and qualifying whole-wafer 1200V MOSFET devices, further boosting confidence in the new solution and its impact on SiC power semiconductor devices...
Source: https://www.semiconductor-today.com/new ... 0922.shtml