SCT First European patent for AlixLabs’ Atomic Layer Etch Pitch Splitting technique

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SCT First European patent for AlixLabs’ Atomic Layer Etch Pitch Splitting technique

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After being granted two US patents by the US Patent Office (US10930515 in February 2021 and US11424130 on 23 August 2022), the European Patent Office (EPO) has issued a notice of intention to grant AlixLabs AB of Lund, Sweden its first European Patent for the firm’s Atomic Layer Etch Pitch Splitting (APS) nanofabrication technique, a new method for manufacturing semiconductor components with a high degree of packing (eliminating several steps in the manufacturing process)...

Source: https://www.semiconductor-today.com/new ... 1022.shtml
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